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PCB (Printed Circuit Board)

Capabilities

  • 2-36 layers (BIB)

  • Up to 110 layers (ATE)

  • 2 mil Line & Spacing

  • Up to 450 mil thick

  • Fine Geometry: 0.3mm pitch

  • Blind and Buried Vias

  • Micro drill & Laser Drill

  • Time Sensitive Delivery

  • Various Substrates including 

  • Global Presence

Volume Production

  • Manufacturing Alliance in South Korea, Taiwan & Japan

  • Complete Logistic management

  • Local Customer Service

  • Competitive Pricing Guarantee

  • NPI Program

  • Global Procurement

  • Complete Turnkey

ATE

Test Board

Load Board

Probe Card

Advantest
Teradyne
Cohu
Chroma
Others​

Handler

Advantest

TechWing

Epson

Others

Highfix Interface Board

Burn In

Advantest
Incal
MCC
Aehr
Others

Burn in Board

System

All Test

&

Handlers

System Control Board

Interface Board

Medical & Others

Interface

Advantest

Chroma

Credence

Teradyne

Others​

Test Board
Load Board
Probe Card
Space Transformer

Need more details? Contact us

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